TechnicalResponsibleforcompletionofprocesssupportandinstallationofLamequipmentatcustomersites.Thisincludesevaluationanddocumentationofprocessoutputsofhardwaremodifications/upgradestoexistingsystems.KeyfieldsupportroleforBetasites,evalsorfirstinfabinstallations.Fieldownertodriveandresolveprocess/systemforrelatedescalationsandqualityinvestigations.Setupandcompleteexperiments,collectdata,generateandanalyzereportsforbothinternalandexternaldistributionandproviderecommendations.DevelopprocessesfornewapplicationsatcustomersitesonexistingLamequipment.Defineroadmapstomeetrequirements,goalsandmilestonesfornewtechnologyprocesssupportingexistingprocesses,correctingprocessdeviationsthroughrootcauseanalysis.Developnewormodifiedprocesses,definebestknownmethodprocessrecipes,andworkcloselywiththehardwareengineeringteamtodefinechamberrequirementsandcharacterizehardwaredesignsthatmeetcustomerperformancerequirements.Designstatisticalexperimentsandanalyzeresultstooptimizedevicearchitectureand/orprocessmodulestoensuretheidentificationandresolutionofprocessanddefectissuesandcommunicateresultsacrosstheorganization.Deliverrobustsolutionstodevelopmentneedsinconjunctionwithdevelopmentengineeringgroups.Providetechnicalsupporttofieldengineers,technicians,andproductsupportpersonnelwhoarediagnosing,troubleshooting,repairinganddebuggingcomplexelectro/mechanicalequipment,computersystems,complexsoftware,ornetworkedand/orwirelesssystems.Presenttechnicalandmarketingmaterialstoahighstandard.Anyotherdutiesasassignedbytheimmediatesupervisor.职能类别：半导体工艺工程师关键字：半导体设备工艺工程师Dep
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